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? 1992 data sheet the m pc8001 is a 3-volt if amplifier ic with an on-chip mixer developed for digital cellular phones. the m pc8001 consists of a high-sensitivity limiter amplifier with an input frequency of 455 khz, a high-speed and high-precision linear rssi (received signal strength indicator ), and a second mixer with an input frequency of 80 to 150 mhz. the m pc8001 features a low 3 ma (typ.) and 2.2 m a (typ.) current consumption at normal operation and power-off, respectively. its high-speed charge/discharge circuit enables fast power-on/off switching. the m pc8001 boasts an extremely small size packaged in a 14-pin plastic shrink sop, and low external capacitances of less than 0.01 m f, in addition to an on-chip rssi output resistor, and is most suitable for high-density mounting. features ? low-voltage operation3 v 10% ? low power consumption(v cc = 3 v) mixer if amp. + rssi during operation 2.1 ma (typ.) 0.95 ma (typ.) at power-off 0 m a (typ.) 2.2 m a (typ.) ? high limiting sensitivityC91 dbm (typ.) ? high-precision rssi linearity 0.5 db (typ.) (v if in = C86 to C6 dbm) ? high-speed rssi response time rssi output rise time 77 m s (typ.) rssi output fall time 113 m s (typ.) ? high-speed power-on/off switching time rise time at power-on 174 m s (typ.) fall time at power-off 3 m s (typ.) ? external capacitors of less than 0.01 m f ? on-chip rssi output resistor (34 k w ) ? ultra-compact package14-pin plastic shrink sop bipolar analog integrated circuit m pc8001 the information in this document is subject to change without notice. document no. ic-3426 (o.d.no. ic-8949) date published february 1995 p printed in japan the mark h shows revised points. ? 1994, 1995 if amplifier ic with on-chip mixer for digital cellular phones
m pc8001 2 ordering information part number package m pc8001gr 14-pin plastic shrink sop (225 mil) 14-pin plastic shrink sop (225 mil) m pc8001gr-e1 embossed carrier taping (pin 1 located toward tape unwind direction) 14-pin plastic shrink sop (225 mil) m pc8001gr-e2 embossed carrier taping (pin 1 located toward tape wind direction)
m pc8001 3 block diagram note input/output impedance of 455 khz bpf: 1.5 k w antenna 1.5 ghz or 900 mhz rf amp 1 st l-osc 1 st mixer 2 nd l-osc 129.545 mhz 130 mhz bpf 455 khz bpf c os c m2 c m1 c m0 osc in mix in2 mix out fil2 mix in1 c fl2 c fl3 c if 0.01 m f 0.01 m f 0.01 m f 0.01 m f 0.01 m f 0.01 m f 2 nd mixer if amp rssi rssi out if out if in fil3 fil1 c fl1 1000 pf c rs pd gnd v cc2 v cc1 r m 1.4 k w note 0.01 m f 0.01 m f 5 2 12 46 7 1 3 13 9 8 11 14 10
m pc8001 4 contents 1. pin configuration and pin functions ............................................................................... 5 2. i/o equivalent circuit ............................................................................................................... 7 3. electrical specifications ........................................................................................................ 8 4. characteristic curves ........................................................................................................... 14 5. test circuit example ............................................................................................................... 18 6. package drawings .................................................................................................................... 19 7. recommended soldering conditions ............................................................................ 20
m pc8001 5 1. pin configuration and pin functions (1) pin configuration (top view) ? 14-pin plastic shrink sop (225 mil) fil1-fil3 : filter gnd : ground if in : intermediate frequency input if out : intermediate frequency output mix in1, mix in2 : mixer input mix out : mixer output osc in : oscillator input pd : power down rssi out : received signal strength indicator output v cc1 , v cc2 : power supply if out pd rssi out fil3 v cc2 if in fil1 mix in1 mix in2 v cc1 osc in gnd mix out fil2 pc8001gr m 14 13 12 11 10 9 8 1 2 3 4 5 6 7
m pc8001 6 (2) pin functions number pin name i/o function 1 if out o if amplifier output 2pd i power-on/off control signal input high level: power-on; low level: power-off 3 pssi out o rssi output 4 fil3 connect capacitor for filter. 5v cc2 if amplifier and rssi power pin 6 if in i if amplifier input 7 fil1 connect capacitor for filter. 8 fil2 connect capacitor for filter. 9 mix out o mixer output 10 gnd ground pin 11 osc in i oscillator input 12 v cc1 mixer power pin 13 mix in2 i connect capacitor for filter. 14 mix in1 i mixer input
m pc8001 7 2. i/o equivalent circuit mixer input if amplifier output oscillator input rssi output if amplifier input power-on/off input mixer output 300 k w 150 k w 50 k w 2 500 w 34 k w v cc2 75 m a 13 14 5 k w 5 k w 5 k w 5 k w 1.5 k w 11 7 4 8 9 400 m a 6 1 3
m pc8001 8 3. electrical specifications absolute maximum ratings (t a = 25 c) parameter symbol conditions rating unit supply voltage v cc 7v total power dissipation p t 300 mw operating ambient temperature t a C30 to +85 c storage temperature t stg C40 to +125 c caution exposure to absolute maximum ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. the parameters apply independently. the device should be operated within the limits specified under dc and ac characteristics. recommended operating conditions (t a = 25 c) parameter symbol conditions min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v mixer input level v mix in see figure 3-1 . 50 w termination C100 C20 dbm note1 lc matching C113 note2 C33 note2 dbm note1 if amplifier input level v if in C86 C6 dbm note1 oscillator input level v osc in C30 C15 C5 dbm note1 if amplifier input frequency f if in 400 455 500 khz mixer input frequency f mix in 80 130 150 mhz mixer output frequency f mix out 400 455 500 khz notes 1. assuming a conversion value of 50 w , 0 dbm = 0.2236 v rms . 2. depends on board wiring pattern, use as reference value.
m pc8001 9 lc matching 33 note 1 electrical characteristics (t a = 25 c, v cc1 = v cc2 = 3 v, f mix in = 130 mhz, f osc in = 129.545 mhz, f if in = 455 khz, c rs = 1000pf, c os = c m1 = c m2 = c m0 = c if = c fl1 = c fl2 = c fl3 = 0.01 m f, 0 dbm = 0.2236 v rms ) (1) mixer parameter symbol conditions min. typ. max. unit supply current i cc1 no signal 2.1 3.0 ma v min in = C50dbm conversion gain cg v osc in = C15 dbm see figure 3-1 . third order intercept ic 3 see figure 3-2 . C13 C8 dbm v osc in =C15dbm C5 0 dbm see figure 3-3 . cut-off frequency f c C3 db point 200 470 mhz noise figure nf see figure 3-6 .10 note 1 db local isolation is l 20 26 db mixer input impedance z im 48-j383 w local input impedance z il 80-j425 w output resistance r om 60 120 180 w v on = 3 v 33 600 m s rise time of pd signal : 10 ns v of = 0 v 3 200 m s fall time of pd signal : 10 ns power-off supply current i lm v of = 0 v 0 10 m a notes 1. depends on board wiring pattern, use as reference value. 2. time until dc voltage of mixer output reaches 10% of power-on value. 3. time until supply current reaches 10% of power-on value. (2) power-on/off parameter symbol conditions min. typ. max. unit power-on input voltage v on power-on over v on and under v cc 1.2 2.4 v power-off input voltage v of power-off over gnd and under v of 0.6 1.2 v power-on input current i on v on = 3 v 48 75 m a 50 w termination 15 20 23 db C1db compression output level v omix power-on rise time note2 t onm power-off fall time note3 t ofm
m pc8001 10 (3) if amplifier/rssi parameter symbol conditions min. typ. max. unit supply current i cc2 no signal 0.95 1.3 ma if amplifier output amplitude v o v if in = C20 dbm 1.2 1.5 1.8 v p-p limiting sensitivity ls C3db point, see figure 4-5 . C91 C86 dbm if amplifier input impedance z in 1.2 1.5 1.8 k w if amplifier phase variation d f v if in =C86 to C6 dbm 11 deg see figure 4-6 note1 . rssi linearity l rs v if in = C86 to C6 dbm 0.5 2db recursive calculation with v if in = C60 to C6 dbm rssi slope sl rs recursive calculation 22.3 24.4 30.1 mv/db with v if in = C60 to C6 dbm rssi intercept ic rs recursive calculation C135 C118 C104 dbm with v if in = C60 to C6 dbm see figure 3-4 . rssi output voltage1 v r1 v if in = C86 dbm 0.50 0.79 0.98 v rssi output voltage 2 v r2 v if in = C46 dbm 1.60 1.79 1.90 v rssi output voltage 3 v r3 v if in = C6 dbm 2.70 2.75 2.82 v rssi output temperature stability s t v if in = C86 to C6 dbm, 1 db t a = C30 to +85 c rssi rise time t rrs v if in = C6 dbm 77 300 m s see figure 3-5 . rssi fall time t frs v if in = C6 dbm 113 300 m s see figure 3-5 . rssi output ripple v rrs v if in = C6 dbm 3 12 mv p-p power-off supply current i li v of = 0 v 2.2 10 m a power-on rise time note2 t oni v on = 3 v, v if in = C86 dbm 174 600 m s pd signal rise time: 10 ns power-off fall time note3 t ofi v of = 0 v 3 200 m s pd signal fall time: 10 ns if amplifier output slew rate sr o v if in = C20 dbm rise note4 3.4 fall note5 3.8 rssi output resistance r or 27 34 41 k w notes 1. use the network analyzer at rbw = 3 hz. 2. time until rssi output reaches 10% of power-on value. 3. time until supply current reaches 10% of power-on value. 4. rise: 10% to 90% 5. fall: 90% to 10% v/ m s h h h h h h h
m pc8001 11 figure 3-1. mixer input (a) 50 w termination (b) lc matching note the values l and c are affected by the parasitic capacitance and inductance of the board. therefore, adjust l and c so that the impedance at the mix in pin from the signal source equals 50 w . remark the signal source impedance is 50 w . figure 3-2. third order intercept remark signal source impedance is 50 w . mix in1 107 nh v mix in 5 pf 0.01 m f 0.01 m f v mix in 50 w 14 mix in1 note note 14 11 14 mix in1 mix out osc in 0.01 m f 0.01 m f 1.5 k w 50 w 16.7 w f 1 f 2 f 1 = 130.1 mhz, f 2 = 130.2 mhz 16.7 w 16.7 w 0.01 m f v osc in = e15 dbm 18 db/oct 6 db/oct f = 130 mhz f 1 = 130.1 mhz f 2 = 130.2 mhz v mix out [dbm] v mix in [dbm] 9 third order intercept 50 w f osc in = 129.545 mhz measure 455 khz component level with spectrum analyzer
m pc8001 12 figure 3-3. C1 db compression output level figure 3-4. rssi intercept 10% t frs t rrs 90% v mix in [dbm] if input level v if in [dbm] 1 db rssi intercept rssi output v ors [v] v mix out [dbm] v omix rssi output if output figure 3-5. rssi response time
m pc8001 13 figure 3-6. noise figure measurement the noise figure is calculated as follows: nf = enr C 10 log (y C 1) nf (db): noise figure enr (db): enr of noise source y: y = 10 n 1 (dbm): spectrum analyzer indication value at sw off. n 2 (dbm): spectrum analyzer indication value at sw on. remark this measurement measures dsb. to measure ssb, add 3 db to nf above. n 2 Cn 1 10 11 9 14 mix in1 osc in mix out 5 pf 0.01 m f 107 nh hp8447f rf amp spectrum analyzer 47 db 50 w 0.01 m f 0.01 m f 3 k w noise source hp346b sw 28 v
m pc8001 14 4. characteristic curves figure 4-1. mixer supply current vs. supply voltage figure 4-2. mixer output level vs. mixer input level (f mix in = 130 mhz, f osc in = 129.545 mhz, f mix out = 455 khz, v osc in = C15 dbm) 4 3 2 1 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 +20 +10 0 C10 C20 C30 C40 C50 C60 C70 C80 C80 C70 C60 C50 C40 C30 C20 C10 0 supply voltage v cc1 [v] mixer input level v mix in [dbm] mixer output level v mix out [dbm] supply current i cc1 [ma] recommended operating range
m pc8001 15 figure 4-4. if amplifier/rssi supply current vs. supply voltage figure 4-3. mixer conversion gain vs. mixer input frequency (v mix in = C30 dbm, v osc in = C15 dbm, f osc in = f mix in C f mix out , f mix out = 455 khz) 3 db 30 20 10 10 100 200 500 700 1000 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 supply voltage v cc2 [v] mixer input frequency f mix in [mhz] supply current i cc2 [ma] mixer conversion gain cg [db] recommended operating range
m pc8001 16 figure 4-5. if amplifier output level vs. if amplifier input level figure 4-6. if amplifier output phase vs. if amplifier input level +30 +20 +10 0 C10 C20 C30 C110 C100 C90 C80 C70 C60 C50 C40 C30 C20 C10 0 3db if amplifier input level v if in [dbm] if amplifier output level v if out [dbm] limitting sensitivity (C91 dbm) 250 240 230 C90 C86 C80 C70 C60 C50 C40 C30 C20 C10 C6 0 if amplifier input level v if in [dbm] if amplifier output phase if out [deg] f f d = 11 deg typ.
m pc8001 17 figure 4-7. rssi output voltage vs. if amplifier input level (the temperature characteristics curves) h 3.0 2.5 2.0 1.5 1.0 0.5 0 e120 e110 e100 e90 e80 e70 e60 e50 e40 e30 e20 e10 0 if amplifier input level v if in [dbm] rssi output voltage v ors [v] t a = e30 ?c t a = +25 ?c t a = +85 ?c the three temperature characteristic curves are virtually identical. remarks 1. 2.
m pc8001 18 5. test circuit example h note the value of the capacitance connected to the if out pin (no. 1) includes the capacitances of pcb wiring patterns and the tester. remark in three cases of mixer input, third order intercept and noise figure measurement, refer to figures 3-1, 3-2, and 3-6. 0.01 f m mix in1 14 0.01 f m mix in2 13 v cc1 12 0.01 f m osc in 11 gnd 10 0.01 f m mix out 9 0.01 f m fil2 8 1000 pf 1 f m + 3 v 50 w 50 w 1.5 k w 1 2 3 4 5 6 1000 pf 1 f m + 3 v 0.01 f m 0.01 f m 50 w 0.01 f m 1000 pf 3 v 0.01 f m 10 pf 50 k w note if out pd rssi out fil3 v cc2 if in fil1 7 pc8001gr m
m pc8001 19 14 pin plastic shrink sop (225 mil) b f g e l k i h j a 14 8 1 7 detail of lead end 5? 5? n m m d c p14gm-65-225b-2 item millimeters inches a b c d e f g h i j k 5.40 max. 0.65 (t.p.) 0.30 0.125 0.075 1.8 max. 1.44 6.2 0.3 0.75 max. 0.213 max. 0.005 0.003 0.071max. 0.244 0.012 0.173 0.030 max. note l m 0.10 0.5 0.2 0.9 4.4 0.012 0.004 0.020 +0.008 ?.009 each lead centerline is located within 0.10 mm (0.004 inch) of its true position (t.p.) at maximum material condition. 0.035 0.057 0.026 (t.p.) +0.10 ?.05 +0.004 ?.003 0.15 +0.10 ?.05 0.006 +0.004 ?.002 n 0.10 0.004 6. package drawings
m pc8001 20 7. recommended soldering conditions the following conditions must be met for soldering conditions of the m pc8001. for more details, refer to our document semiconductor device mounting technology manual (iei-1207). please consolt with our sales offices in case other soldering process is used, or in case the soldering is done under different conditions. types of surface mount device m pc8001gr: 14-pin plastic shrink sop (225 mil) soldedering process soldering conditions symbol infrared ray reflow peak temperature of package surface: 235 ?c or below, ir35-107-2 reflow time: 30 seconds or below (210 ?c or higher), number of reflow processes: max. 2 [remark] (1) please start the second reflow process after the temperature, raised by the first reflow process, returns to normal. (2) please avoid removing the residual flux with water after the first reflow process. partial heating terminal temperature: 300 ?c or below, method time: 3 seconds or below (per one side of the device).
m pc8001 21 precautions against static electricity caution when handling the device, be careful to protect it from static electricity. exposure to a strong static electricity charge may destroy internal transistor junctions. during transportation and storage, place the device in the conductive tray or case originally provided by nec for shipping, or conductive shock absorbing material, metal case, etc. during assembly, be sure to ground the device. be careful not to place the device on a plastic board and do not touch the device's pins.
m pc8001 22 [memo] no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: standard, special, and specific. the specific quality grade applies only to devices developed based on a customer designated quality assurance program for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices in standard unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 94.11

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